The 6th IEEE Non-Volatile Memory Systems and Applications Symposium

NVMSA 2017 | Hsinchu, Taiwan | August 16-18, 2017

  • Hsinchu, Taiwan
  • National Chiao-Tung University

Organizers

Steering Committee

Steering Committee Co-Chairs
Yiran Chen, Duke University, USA
Tei-Wei Kuo, National Taiwan University, Taiwan
Steering Committee Members
Kiyoung Choi, Seoul National University, Korea
Nikil Dutt, University of California, Irvine, USA
Hiroshi Nakamura, the University of Tokyo, Japan
Edwin Sha, Chongqing University, China
Zili Shao, Hong Kong Polytechnic University, Hong Kong
Jiwu Shu, Tsinghua University, China
Lionel Torres, University of Montpellier 2, France
Chun (Jason) Xue, City University of Hong Kong, Hong Kong

Organizing Committee

General Co-Chairs
Tei-Wei Kuo, National Taiwan University, Taiwan
Sungjoo Yoo, Seoul National University, Korea
Program Co-Chairs
Yuan-Hao Chang, Academia Sinica, Taiwan
Toshio Endo, Tokyo Institute of Technology, Japan
Poster Chair
Chien-Chung Ho, National Chung Cheng University, Taiwan
Publicity Co-Chairs
Pi-Cheng Hsiu, Academia Sinica, Taiwan
Jingtong Hu, Oklahoma State University, USA
Mehdi B. Tahoori, Karlsruhe Institute of Technology, Germany
Hao Yu, Nanyang Technological University, Singapore
Finance Chair
Po-Chun Huang, National Taipei University of Technology, Taiwan
Publication Chair
Chia-Heng Tu, National Cheng Kung University, Taiwan
Local Arrangement Chair
Che-Wei Chang, Chang Gung University, Taiwan
Web Chair
Ming-Chang Yang, The Chinese University of Hong Kong, Hong Kong

Program Committee Members

Eishi Arima, The University of Tokyo, Japan
Woongki Baek, Ulsan National Institute of Science and Technology, Korea
Hyokyung Bahn, Ewha Womes’s University, Korea
Luis Angel D. Bathen, IBM Research, USA
Jalil Boukhobza, Université de Bretagne Occidentale, France
Da-Wei Chang, National Cheng Kung University, Taiwan
Meng-Fan Chang, National Tsinghua University, Taiwan
Li-Pin Chang, National Chiao-Tung University, Taiwan
Che-Wei Chang, Chang Gung University, Taiwan
Zhuan Chen, Microsoft
Tseng-Yi Chen, Academia Sinica
Feng Chen, Louisiana State University, USA
Hsiang-Yun Cheng, Academia Sinica, Taiwan
Bruce Childers, University of Pittsburgh, USA
Jongmoo Choi, Dankook University, Korea
Kiyoung Choi, Seoul National University, Korea
Nikil Dutt, University of California at Irvine, USA
Shinobu Fujita, Toshiba, Japan
Tony Givargis, University of California, Irvine
Rajesh Gupta, University of California, San Diego, USA
Aayush Gupta, IBM Research, USA
Shuibing He, Wuhan University, China
Takahiro Hirofuchi, National Institute of Advanced Industrial Science and Technology (AIST), Japan
Pi-Cheng Hsiu, Academia Sinica, Taiwan
Jingtong Hu, Oklahoma State University, USA
Shiyan Hu, Michigan Technological University
Yu Hua, Huazhong University of Science and Technology, China
Po-Chun Huang, National Taipei University of Technology, Taiwan
Jinho Hwang, IBM Research, USA
Lei Jiang, Indiana University
Song Jiang, Wayne State University, USA
Lei Ju, Shandong University, China
Changhee Jung, Virginia Tech, USA
Myoungsoo Jung, Yonsei Univeristy, Korea
Jaegeuk Kim, Huawei, China
Nam Sung Kim, University of Illinois, Urbana-Champaign, USA
Jihong Kim, Seoul National University, Korea
Youngjae Kim, Sogang University, Korea
Kyoungwoo Lee, Yonsei University, Korea
Patrick P.C. Lee, The Chinese University of Hong Kong, Hong Kong
Tao Li, University of Florida, USA
Duo Liu, Chongqing University, China
Yongpan Liu, Tsinghua University, China
Gary Liu, New Jersey Institute of Technology, USA
Jay Lofstead, Sandia National Laboratory, USA
Rami Melhem, University of Pittsburgh, USA
Hiroko Midorikawa, Seikei Univ, Japan
Onur Mutlu, Carnegie Mellon University (CMU), USA
Vijayanand Nagarajan, University of Edinburgh, UK
Takashi Nakada, Nara Institute of Science and Technology, Japan
Hiroshi Nakamura, the University of Tokyo, Japan
Beomseok Nam, Ulsan National Institute of Science & Technology, Korea
Preeti Ranjan Panda, Indian Institute of Technology Delhi, India
José Ignacio Gómez Pérez, University of Madrid, Spain
Pradeep Ramachandran, MulticoreWare, India
Jia Rao, The University of Texas at Arlington, USA
Hitoshi Sato, National Institute of Advanced Industrial Science and Technology (AIST), Japan
Zili Shao, Hong Kong Polytechnic University, Hong Kong
Liang Shi, Chongqing University, China
Dongkun Shin, Sungkyunkwan University, Korea
Guangyu Sun, Peking University, China
Ryosei Takano, National Institute of Advanced Industrial Science and Technology (AIST), Japan
Ken Takeuchi, Chuo Univ, Japan
Hiroyuki Tomiyama, Ritsumeikan University, Japan
Hung-Wei Tseng, North Carolina State University (NCSU), USA
Chia-Heng Tu, National Cheng Kung University, Taiwan
Yu Wang, Tsinghua University, China
Chundong Wang, A*STAR, Singapore
Avani Wildani, Emory University, USA
Chin-Hsien Wu, National Taiwan University of Science and Technology, USA
Weijun Xiao, Virginia Commonwealth University, USA
Tao Xie, San Diego State University, USA
Chun (Jason) Xue, City University of Hong Kong, Hong Kong
Ming-Chang Yang, The Chinese University of Hong Kong, Hong Kong
Chia-Lin Yang, National Taiwan University, Taiwan
Chengmo Yang, University of Delaware, USA
Youtao Zhang, University of Pittsburgh
Ming Zhao, Arizona State University, USA
Jishen Zhao, University of California at Santa Cruz, USA
Fang Zheng, IBM Research, USA
Jianwen Zhu, University of Toronto, Canada